Servicio Familia 
Bond Pull Test for Current Source ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Current Source ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
22 results found for Current Source/Power Management/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
PROTO
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-4
QML K
Qualified
QPDSIS-38534
Surface Mount
CQFP-40
TID (HDR): 100.0
TID (LDR): 15.0
QML K
Qualified
QPDSIS-38534
Surface Mount
CFP-18
QML K
Qualified
QPDSIS-38534
Surface Mount
CFP-18
TID (HDR): 100.0
TID (LDR): 15.0
QML K
Qualified
QPDSIS-38534
Surface Mount
CFP-18
PROTO
Not qualified
NOT LISTED IN QPL
Evaluation Board
Evaluation Board
TID (HDR): 0.0
QML V
Qualified
QPDSIS-38535
DIE
DIE
TID (HDR): 100.0
TID (LDR): 50.0
SEL (Let): 86.0
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
TID (HDR): 0.0
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
TID (HDR): 0.0
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-4
TID (HDR): 100.0
TID (LDR): 50.0
SEL (Let): 86.0
Part validation activities
Cost & Activity Matrix