


Cross Sectioning for Current Sense Amplifier
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Current Sense Amplifier
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
55 results found for Current Sense-Shunt/Amplifier/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
AEC-Q
Qualified
AEC-Q100
GOLD
Surface Mount
SOT-23-5
QML K
Not qualified
QPDSIS-38534
Surface Mount
CFP-10
PROTO
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-10
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-8
QML H
Not qualified
QPDSIS-38534
Surface Mount
CFP-10 (Gull Wing)
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-10
PROTO
Not qualified
NOT LISTED IN QPL
Evaluation Board
Evaluation Board
QML K
Not qualified
QPDSIS-38534
Surface Mount
CFP-10 (Gull Wing)
QML H
Not qualified
QPDSIS-38534
Surface Mount
CFP-10
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-10
Part validation activities
Cost & Activity Matrix