Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

Cross Sectioning for Counter-Divider ICs

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

EEE Parts Results Page

Cross Sectioning for Counter-Divider ICs

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close

1303 results found for Counter-Divider/Logic/Digital/Microcircuits

Reset