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doEEEt Bond Pull Test for Common Mode Chokes | doEEEt.com
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Bond Pull Test for Common Mode Chokes

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

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EEE Parts Results Page

Bond Pull Test for Common Mode Chokes

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

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881 results found for Common Mode Chokes/Filters

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M27/372-002
M27/372 50uH (Each Winding) ±10% Chip
Vanguard
MIL-PRF-27/372

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-27
-55ºC to +125ºC
Surface Mount
Chip
600mA

M27/372-082
M27/372 1,22mH (Each Winding) ±12% Chip
Vanguard
MIL-PRF-27/372

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-27
-55ºC to +125ºC
Surface Mount
Chip
1,7A

M27/372-034
M27/372 3,75H (Each Winding) ±10% Chip
Rayco Electronics Manufacturing Inc
MIL-PRF-27/372

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-27
-55ºC to +125ºC
Surface Mount
Chip
70mA

M27/372-084
M27/372 2,2mH (Each Winding) ±12% Chip
Vanguard
MIL-PRF-27/372

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-27
-55ºC to +125ºC
Surface Mount
Chip
1,2A

M27/372-027
M27/372 1,5H (Each Winding) ±10% Chip
Rayco Electronics Manufacturing Inc
MIL-PRF-27/372

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-27
-55ºC to +125ºC
Surface Mount
Chip
160mA

M27/372-047
M27/372 100uH (Each Winding) ±12% Chip
Vanguard
MIL-PRF-27/372

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-27
-55ºC to +125ºC
Surface Mount
Chip
1,1A

M27/372-061
M27/372 22uH (Each Winding) ±12% Chip
Vanguard
MIL-PRF-27/372

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-27
-55ºC to +125ºC
Surface Mount
Chip
3A

M27/372-021
M27/372 1H (Each Winding) ±10% Chip
Coast - Advanced Chip Magnetics
MIL-PRF-27/372

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-27
-55ºC to +125ºC
Surface Mount
Chip
75mA

M27/372-067
M27/372 500uH (Each Winding) ±12% Chip
Vanguard
MIL-PRF-27/372

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-27
-55ºC to +125ºC
Surface Mount
Chip
600mA

M27/372-092
M27/372 5,3mH (Each Winding) ±12% Chip
Vanguard
MIL-PRF-27/372

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-27
-55ºC to +125ºC
Surface Mount
Chip
550mA
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