


Bond Pull Test for Common Mode Chokes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Common Mode Chokes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
881 results found for Common Mode Chokes/Filters
Part reference
Quality level / QPL
Package
Rated Current
Unit price
Lead time
LEVEL M
Qualified
QPDSIS-27
Surface Mount
Chip
600mA
LEVEL M
Qualified
QPDSIS-27
Surface Mount
Chip
1,7A
LEVEL M
Qualified
QPDSIS-27
Surface Mount
Chip
70mA
LEVEL M
Qualified
QPDSIS-27
Surface Mount
Chip
1,2A
LEVEL M
Qualified
QPDSIS-27
Surface Mount
Chip
160mA
LEVEL M
Qualified
QPDSIS-27
Surface Mount
Chip
1,1A
LEVEL M
Qualified
QPDSIS-27
Surface Mount
Chip
3A
LEVEL M
Qualified
QPDSIS-27
Surface Mount
Chip
75mA
LEVEL M
Qualified
QPDSIS-27
Surface Mount
Chip
600mA
LEVEL M
Qualified
QPDSIS-27
Surface Mount
Chip
550mA
Part validation activities
Cost & Activity Matrix