


Cross Sectioning for Clock Buffer-Driver
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Clock Buffer-Driver
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
99 results found for Clock Buffer-Driver/Clock and Timing/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Ratio - Input:Output
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-8
Fanout Buffer
1:2
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
PQCC-28 (J-Lead)
Driver
1:9
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LQFP-32
Fanout Buffer
1:6
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-24
Buffer
1:10
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LQFP-32
Driver
1:5
QML Q
Not qualified
QPDSIS-38535
Through Hole Mount
CPGA-29
Zero-Delay Buffer with Divider
1:6
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-16
Fanout Buffer
1:2
QML M
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Fanout Buffer
2:10
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-16
Fanout Buffer
TID (HDR): 100.0
SEL (Let): 80.0
1:2
QML Q
Qualified
QPDSIS-38535
DIE
DIE
Fanout Buffer
TID (HDR): 100.0
SEL (Let): 111.0
SEU (Let): 66.0
1:8
Part validation activities
Cost & Activity Matrix