Skip to Content
  • Resources
    • COTS For Space WEBINARS
    • EEE Components
    • SPECIFICATIONS / QPLs
    • Events / Webinars
    • Space Talks
    • Tech Articles
    • Manufacturer Notifications
  • Laboratory Services
    • Laboratory Standard Testing
    • Non Standard Testing
    • Silicon Carbide -SiC- Diodes
    • CrowdTesting
    • Optoelectronics
    • Small Sats
    • Representative Projects / Papers
  • Additional Services
    • Industry 4.0 Cybersecurity (IEC 62443) NEW
    • Penetration Test NEW
    • Cybersecurity Certified (CSC) NEW
    • Code Score Matrix NEW
    • Long-term storage of wafers
    • Electronic Design
  • Tools
    • Comparator
    • MYDCLs / BOMs
    • esa-stockplace
  • About Us
  • Proposal Next
  • Sign In
Cookies on the doEEEt website. We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on the doEEEt website. However, if you would like to, you can change your cookie settings at any time. Link to cookies policy.
doEEEt Bond Pull Test for Clock Buffer-Driver | doEEEt.com
  • Home
  • How does doEEEt works
  • About us
  • Contact Us
  • Terms of Use
  • Disclaimer
  • Privacy Policy
  • Privacy Policy and Legal Notice
  • Cookie Policy
  • Copyright
  • autosignup2
  • Instant Quote
  • Introducing NanoXplore And Its European FPGA’s ITAR Free
  • Space Talks 3 - Dan Friedlander
  • autosignup3
  • Shopping Cart
  • wpo
  • Data Protection
  • Components
  • Documents
Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

Bond Pull Test for Clock Buffer-Driver

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

Related content

X-Ray Inspection applied to DPA test

Non-destructive internal inspection of EEE parts and passive components

electrical testing

Alter Technology SAM Additional Testing Capabilities

procurement-EEE-Parts

Reasons to do an Element Evaluation Procedure of EEE Parts

EEE Parts Results Page

Bond Pull Test for Clock Buffer-Driver

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close
  • Microcircuits
    • Clock and Timing
      • Clock Buffer-Driver

99 results found for Clock Buffer-Driver/Clock and Timing/Microcircuits

Reset
Part reference
Quality level / QPL
TOP
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Ratio - Input:Output
Unit price
Lead time

MC100EP11DTG
MC100EP11DTG
On Semiconductor
MFR DS MC10EP11/D

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
TSSOP-8
Fanout Buffer
1:2

CDCVF111FN
CDCVF111FN
Texas Instruments
MFR DS SCAS670

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
PQCC-28 (J-Lead)
Driver
1:9

NB4L6254FAR2G
NB4L6254FAR2G
On Semiconductor
MFR DS NB4L6254/D

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
LQFP-32
Fanout Buffer
1:6

CDCVF2310PW
CDCVF2310PW
Texas Instruments
MFR DS SCAS666

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
TSSOP-24
Buffer
1:10

MC100EP210SFAG
MC100EP210SFAG
On Semiconductor
MFR DS MC100EP210S/D

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
LQFP-32
Driver
1:5

5962-9319602QZC
TS88915TMRBQ70
Teledyne e2v Semiconductors
5962-93196

Compare DCL / BOM Cart
QML Q
Not qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CPGA-29
Zero-Delay Buffer with Divider
1:6

ADCLK925AF-EMX
ADCLK925AF-EMX
Analog Devices
5962-13205 (elec./mec. only)

Compare DCL / BOM Cart
EM
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-16
Fanout Buffer
1:2

5962-9576101M2A
P49FCT805BTLMB
Pyramid Semiconductor
5962-95761

Compare DCL / BOM Cart
QML M
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-20
Fanout Buffer
2:10

5962R1320501VXA
ADCLK925AF/QMLR
Analog Devices
5962-13205

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-16
Fanout Buffer
TID (HDR): 100.0
SEL (Let): 80.0
1:2

5962R0623302Q9A
UT54ALVC2525R-QDIE
Frontgrade Colorado Springs LLC
5962-06233

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
DIE
DIE
Fanout Buffer
TID (HDR): 100.0
SEL (Let): 111.0
SEU (Let): 66.0
1:8
Part validation activities
Cost & Activity Matrix
  • <
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • >
Alter Technology Laboratory Services
  • Screening
  • Evaluation/Qualification
  • Scanning Acoustic Microscopy
  • RF/Microwave
  • Incoming Inspection
  • DPA

EEE Components
  • Capacitors
  • Microcircuits
  • Resistors
  • Crystals and Oscillators
  • Schottky Barrier Rectifiers
  • Discretes

Laboratory Success Cases
  • GRACE Project
  • XRAY, SAM and Cross Section
  • SiC schottky Diode
  • JUICE Case
  • Deimos Neptuno
  • Melissa III

Company
  • About Us
  • Contact-us
  • How does doEEEt works?
Security & Privacity
  • Privacy Policy and Legal Notice
  • Copyright
  • Contact Clause
  • LinkedIn LinkedIn
  • Twitter Twitter
Copyright © 2025 ALTER TECHNOLOGY TÜV NORD S.A.U
All rights reserved.