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Bond Pull Test for Clock Buffer-Driver
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Clock Buffer-Driver
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
99 results found for Clock Buffer-Driver/Clock and Timing/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Ratio - Input:Output
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-8
Fanout Buffer
1:2
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LQFP-32
Fanout Buffer
1:6
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
PQCC-28 (J-Lead)
Driver
1:9
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-24
Buffer
1:10
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LQFP-32
Driver
1:5
QML M
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
Fanout Buffer
1:5
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CQCC-28 (J-Lead)
Zero-Delay Buffer with Divider
1:6
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-14
Fanout Buffer
TID (HDR): 300.0
SEL (Let): 111.0
SEU (Let): 66.0
1:8
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-14