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doEEEt Cross Sectioning for Ceramic Capacitors | doEEEt.com
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Cross Sectioning for Ceramic Capacitors

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

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EEE Parts Results Page

Cross Sectioning for Ceramic Capacitors

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

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  • Capacitors
    • Ceramic

1129558 results found for Ceramic/Capacitors

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Quality level / QPL
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Package
Capacitance [Nom]
Characteristic
DC Rated Voltage
Dielectric Class
Temperature Coefficient of Capacitance
Tolerance
Unit price
Lead time

3009040041471GX
CEC404S Type I 1,47nF ±2% 16V ±30ppm/ºC Chip 1210
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/040

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1210 (3225 Metric)
1,47nF
C0G, NP0
16V
Class 1
0±30ppm/ºC
±2%

3009040021471GC
CEC204S Type I 1,47nF ±2% 50V ±30ppm/ºC Chip 0805
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/040

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
0805 (2012 Metric)
1,47nF
C0G, NP0
50V
Class 1
0±30ppm/ºC
±2%

3009003063740FC
CEC202S Type I 374pF ±1% 50V ±30ppm/ºC Chip 0805
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/003

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
0805 (2012 Metric)
374pF
C0G, NP0
50V
Class 1
0±30ppm/ºC
±1%

300903903562KC
CNC1204S Type II 5,6nF ±10% 50V Chip 1206
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/039

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1206 (3216 Metric)
5,6nF
X7R
50V
Class 2
See Spec
±10%

30090220611C5GC
CEC1202S Type I 11,5pF ±2% 50V ±30ppm/ºC Chip 1206
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/022

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1206 (3216 Metric)
11,5pF
C0G, NP0
50V
Class 1
0±30ppm/ºC
±2%

30090220637C4FX
CEC1202S Type I 37,4pF ±1% 16V ±30ppm/ºC Chip 1206
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/022

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1206 (3216 Metric)
37,4pF
C0G, NP0
16V
Class 1
0±30ppm/ºC
±1%

3009040034700JC
CEC1204S Type I 470pF ±5% 50V ±30ppm/ºC Chip 1206
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/040

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1206 (3216 Metric)
470pF
C0G, NP0
50V
Class 1
0±30ppm/ºC
±5%

3009040031471FX
CEC1204S Type I 1,47nF ±1% 16V ±30ppm/ºC Chip 1206
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/040

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1206 (3216 Metric)
1,47nF
C0G, NP0
16V
Class 1
0±30ppm/ºC
±1%

3009040048451FC
CEC404S Type I 8,45nF ±1% 50V ±30ppm/ºC Chip 1210
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/040

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1210 (3225 Metric)
8,45nF
C0G, NP0
50V
Class 1
0±30ppm/ºC
±1%

3009004061180FA
CEC402S Type I 118pF ±1% 25V ±30ppm/ºC Chip 1210
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/004

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1210 (3225 Metric)
118pF
C0G, NP0
25V
Class 1
0±30ppm/ºC
±1%
Part validation activities
Cost & Activity Matrix
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