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doEEEt Bond Pull Test for Ceramic Capacitors | doEEEt.com
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Bond Pull Test for Ceramic Capacitors

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

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EEE Parts Results Page

Bond Pull Test for Ceramic Capacitors

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

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  • Capacitors
    • Ceramic

1129558 results found for Ceramic/Capacitors

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Part reference
Quality level / QPL
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Package
Capacitance [Nom]
Characteristic
DC Rated Voltage
Dielectric Class
Temperature Coefficient of Capacitance
Tolerance
Unit price
Lead time

3009003064530FX
CEC202S Type I 453pF ±1% 16V ±30ppm/ºC Chip 0805
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/003

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
0805 (2012 Metric)
453pF
C0G, NP0
16V
Class 1
0±30ppm/ºC
±1%

300903807102JE
CNC1402S Type II 1nF ±5% 100V Chip 0603
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/038

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
0603 (1608 Metric)
1nF
X7R
100V
Class 2
See Spec
±5%

3009040063571FC
CEC704S Type I 3,57nF ±1% 50V ±30ppm/ºC Chip 2220
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/040

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
2220 (5750 Metric)
3,57nF
C0G, NP0
50V
Class 1
0±30ppm/ºC
±1%

300103605C223MP
H5440 22nF 20% 2kV Radial
Exxelia SAS -Site de Pessac-
ESCC 3001/036

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
Radial
5440 (137100 Metric)
22nF
X7R
2kV
Class 2
See Spec
±20%

300903607C1C7B4L
CHB TYPE I 1,7pF 0,1pF 500V 100ppm/ºC 1111
Exxelia SAS -Site de Pessac-
ESCC 3009/036

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1111 (2828 Metric)
1,7pF
P100
500V
Class 1
100±30ppm/ºC
±0,1pF

300103603C223MM
H2520 22nF 20% 1kV Radial
Exxelia SAS -Site de Pessac-
ESCC 3001/036

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
Radial
2520 (6450 Metric)
22nF
X7R
1kV
Class 2
See Spec
±20%

300103604C104MM
H3333 100nF 20% 1kV Radial
Exxelia SAS -Site de Pessac-
ESCC 3001/036

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
Radial
3333 (8484 Metric)
100nF
X7R
1kV
Class 2
See Spec
±20%

3009005069310FE
CEC602S Type I 931pF ±1% 100V ±30ppm/ºC Chip 1812
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/005

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1812 (4532 Metric)
931pF
C0G, NP0
100V
Class 1
0±30ppm/ºC
±1%

300103602C271KS
H2020 270pF 10% 4kV Radial
Exxelia SAS -Site de Pessac-
ESCC 3001/036

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
Radial
2020 (5050 Metric)
270pF
X7R
4kV
Class 2
See Spec
±10%

300903505B330G4C
CHA TYPE I 33pF 2% 50V 100ppm/ºC 0606
Exxelia SAS -Site de Pessac-
ESCC 3009/035

Compare DCL / BOM Cart
ESCC B
Not qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
0606 (1616 Metric)
33pF
P100
50V
Class 1
100±30ppm/ºC
±2%
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