


Bond Pull Test for Ceramic Capacitors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Ceramic Capacitors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1129558 results found for Ceramic/Capacitors
Part reference
Quality level / QPL
Package
Capacitance [Nom]
Characteristic
DC Rated Voltage
Dielectric Class
Temperature Coefficient of Capacitance
Tolerance
Unit price
Lead time
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
0805 (2012 Metric)
453pF
C0G, NP0
16V
Class 1
0±30ppm/ºC
±1%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
0603 (1608 Metric)
1nF
X7R
100V
Class 2
See Spec
±5%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
2220 (5750 Metric)
3,57nF
C0G, NP0
50V
Class 1
0±30ppm/ºC
±1%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Radial
5440 (137100 Metric)
22nF
X7R
2kV
Class 2
See Spec
±20%
ESCC C
Not qualified
ESCC QPL
Surface Mount
Chip
1111 (2828 Metric)
1,7pF
P100
500V
Class 1
100±30ppm/ºC
±0,1pF
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Radial
2520 (6450 Metric)
22nF
X7R
1kV
Class 2
See Spec
±20%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Radial
3333 (8484 Metric)
100nF
X7R
1kV
Class 2
See Spec
±20%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
1812 (4532 Metric)
931pF
C0G, NP0
100V
Class 1
0±30ppm/ºC
±1%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Radial
2020 (5050 Metric)
270pF
X7R
4kV
Class 2
See Spec
±10%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
0606 (1616 Metric)