


Bond Pull Test for Ceramic Capacitors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Ceramic Capacitors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1129558 results found for Ceramic/Capacitors
Part reference
Quality level / QPL
Package
Capacitance [Nom]
Characteristic
DC Rated Voltage
Dielectric Class
Temperature Coefficient of Capacitance
Tolerance
Unit price
Lead time
SPACE
Qualified
GSFC-311-QPLD
Surface Mount
Chip
0805 (2012 Metric)
56nF
X7R
25V
Class 2
±15%
±10%
SPACE
Qualified
GSFC-311-QPLD
Surface Mount
Chip
0805 (2012 Metric)
100nF
X7R
25V
Class 2
±15%
±20%
SPACE
Qualified
GSFC-311-QPLD
Surface Mount
Chip
0805 (2012 Metric)
68nF
X7R
25V
Class 2
±15%
±10%
SPACE
Qualified
GSFC-311-QPLD
Surface Mount
Chip
0805 (2012 Metric)
68nF
X7R
25V
Class 2
±15%
±20%
SPACE
Qualified
GSFC-311-QPLD
Surface Mount
Chip
0805 (2012 Metric)
100nF
X7R
25V
Class 2
±15%
±20%
SPACE
Qualified
GSFC-311-QPLD
Surface Mount
Chip
0805 (2012 Metric)
68nF
X7R
25V
Class 2
±15%
±20%
SPACE
Qualified
GSFC-311-QPLD
Surface Mount
Chip
2225 (5763 Metric)
3,9nF
C0G, NP0
50V
Class 1
0±30ppm/ºC
±2%
SPACE
Qualified
GSFC-311-QPLD
Surface Mount
Chip
1725 (4364 Metric)
8,2nF
X7R
50V
Class 2
±15%
±10%
SPACE
Qualified
GSFC-311-QPLD
Surface Mount
Chip
1712 (4332 Metric)
2,0nF
C0G, NP0
25V
Class 1
0±30ppm/ºC
±1%
SPACE
Qualified
GSFC-311-QPLD
Surface Mount
Chip
0912 (2432 Metric)