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Bond Pull Test for CAN Transceivers
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for CAN Transceivers
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
71 results found for CAN Transceivers/Communication-Interface/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOIC-8
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOIC-20
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-8
LEANREL
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-8
LEANREL
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8
QML V
Qualified
QPDSIS-38535
DIE
DIE
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
Part validation activities
Cost & Activity Matrix