Servicio Familia 
Bond Pull Test for Atomic Clocks
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Atomic Clocks
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1 results found for Atomic Clocks/Crystals and Oscillators
Part reference
Quality level / QPL
Package
Aging
Frequency
Stability
Unit price
Lead time
HIREL RT
Not qualified
NOT LISTED IN QPL
Through Hole Mount
DIL-9
1,6" L x 1,39" D (40,64mm x 35,31mm)
1e-8, 1 year
10MHz
Part validation activities
Cost & Activity Matrix