


Cross Sectioning for Analog Mux-Demux
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Analog Mux-Demux
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
375 results found for Analog Mux-Demux/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-16
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-16
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-16
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-28
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
QML K
Qualified
QPDSIS-38534
Surface Mount
CQFP-96
QML V
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
QML K
Qualified
QPDSIS-38534
Surface Mount
CFP-16 (Gull Wing)
Part validation activities
Cost & Activity Matrix