Servicio Familia 
Bond Pull Test for Analog Mux-Demux
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Analog Mux-Demux
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
381 results found for Analog Mux-Demux/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-16
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-16
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-16
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-16
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CQLCC-20
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
Part validation activities
Cost & Activity Matrix