


Cross Sectioning for ASIC
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for ASIC
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
1968 results found for ASIC/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
QML V
Qualified
QPDSIS-38535
Surface Mount
CLGA-255
TID (HDR): 300.0
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-256
TID (HDR): 300.0
QML V
Qualified
QPDSIS-38535
Surface Mount
CQFP-352
TID (HDR): 300.0
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-352
TID (HDR): 300.0
QML V
Qualified
QPDSIS-38535
Surface Mount
CQFP-352
TID (HDR): 100.0
QML Q
Qualified
QPDSIS-38535
Not Available
Not Available
ESCC
Not qualified
ESCC QPL
Surface Mount
MCQFP-256
TID (HDR): 100.0
SEL (Let): 80.0
SEU (Let): 15.0
ESCC
Not qualified
ESCC QPL
Surface Mount
CLGA-349
TID (HDR): 100.0
SEL (Let): 80.0
SEU (Let): 15.0
ESCC
Not qualified
ESCC QPL
Surface Mount
CLGA-472
TID (HDR): 100.0
SEL (Let): 80.0
SEU (Let): 15.0
ESCC
Not qualified
ESCC QPL
Surface Mount
MCQFP-256
TID (HDR): 100.0
SEL (Let): 80.0
SEU (Let): 15.0
Part validation activities
Cost & Activity Matrix