


Cross Sectioning for ASIC
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for ASIC
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
1962 results found for ASIC/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
QML V
Qualified
QPDSIS-38535
Surface Mount
CBGA-472
TID (HDR): 300.0
QML V
Qualified
QPDSIS-38535
Not Available
Not Available
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-64
TID (HDR): 500.0
QML V
Qualified
QPDSIS-38535
Surface Mount
CLGA-255
TID (HDR): 300.0
QML Q
Not qualified
QPDSIS-38535
Not Available
Not Available
QML Q
Qualified
QPDSIS-38535
Surface Mount
CLGA-255
TID (HDR): 300.0
QML Q
Qualified
QPDSIS-38535
Not Available
Not Available
QML V
Qualified
QPDSIS-38535
Not Available
Not Available
TID (HDR): 100.0
QML V
Qualified
QPDSIS-38535
Through Hole Mount
PPGA-349
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-64
TID (HDR): 500.0
Part validation activities
Cost & Activity Matrix