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Cross Sectioning for ASIC

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

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Failure Analysis in Microsection Inspection

Constructional Analysis

Constructional Analysis in Microsection Inspection

EEE Parts Results Page

Cross Sectioning for ASIC

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

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  • Microcircuits
    • ASIC

1968 results found for ASIC/Microcircuits

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Part reference
Quality level / QPL
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Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time

5962F07B0115VZC
HX311G
Honeywell Aerospace
5962-07B01

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
not available
Surface Mount
CLGA-255
TID (HDR): 300.0

5962F06B0102QUC
HX306G
Honeywell Aerospace
5962-06B01

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
not available
Surface Mount
CQFP-256
TID (HDR): 300.0

5962F06B0115V5C
HX311G
Honeywell Aerospace
5962-06B01

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
not available
Surface Mount
CQFP-352
TID (HDR): 300.0

5962F06B0131Q4C
HX311P
Honeywell Aerospace
5962-06B01

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
not available
Surface Mount
CQFP-352
TID (HDR): 300.0

5962R00B0305V7C
SMYC-G2270PHxxxSR
Microchip Technology Nantes formerly Atmel
5962-00B03

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQFP-352
TID (HDR): 100.0

5962-00B0304Q*C
MG2142P
Microchip Technology Nantes formerly Atmel
5962-00B03

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Not Available
Not Available

920207610R
TH1242ER
Microchip Technology Nantes formerly Atmel
ESCC 9202/076

Compare DCL / BOM Cart
ESCC
Not qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
MCQFP-256
TID (HDR): 100.0
SEL (Let): 80.0
SEU (Let): 15.0

920207673R
TH1M156ES
Microchip Technology Nantes formerly Atmel
ESCC 9202/076

Compare DCL / BOM Cart
ESCC
Not qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
CLGA-349
TID (HDR): 100.0
SEL (Let): 80.0
SEU (Let): 15.0

920207672R
TH1M156ES
Microchip Technology Nantes formerly Atmel
ESCC 9202/076

Compare DCL / BOM Cart
ESCC
Not qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
CLGA-472
TID (HDR): 100.0
SEL (Let): 80.0
SEU (Let): 15.0

920207636R
TH1M242ER
Microchip Technology Nantes formerly Atmel
ESCC 9202/076

Compare DCL / BOM Cart
ESCC
Not qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
MCQFP-256
TID (HDR): 100.0
SEL (Let): 80.0
SEU (Let): 15.0
Part validation activities
Cost & Activity Matrix
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