


Cross Sectioning for AD Converters
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for AD Converters
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
469 results found for Analog to Digital Converters/Data Converter/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
GOLD
Surface Mount
TSSOP-16
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LFCSP-32
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LQFP-44
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LFCSP-10
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LQFP-48
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-38
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-16
QML N
Qualified
QPDSIS-38535
Surface Mount
TSSOP-32
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-18
883
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
Part validation activities
Cost & Activity Matrix