Servicio Familia 
Bond Pull Test for AD Converters
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for AD Converters
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
478 results found for Analog to Digital Converters/Data Converter/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
GOLD
Surface Mount
TSSOP-16
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LQFP-44
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LFCSP-32
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LFCSP-10
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LQFP-48
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-38
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-16
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-28
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-32
Part validation activities
Cost & Activity Matrix