Skip to Content
  • Resources
    • COTS For Space WEBINARS
    • EEE Components
    • SPECIFICATIONS / QPLs
    • Events / Webinars
    • Space Talks
    • Tech Articles
    • Manufacturer Notifications
  • Laboratory Services
    • Laboratory Standard Testing
    • Non Standard Testing
    • Silicon Carbide -SiC- Diodes
    • CrowdTesting
    • Optoelectronics
    • Small Sats
    • Representative Projects / Papers
  • Additional Services
    • Industry 4.0 Cybersecurity (IEC 62443) NEW
    • Penetration Test NEW
    • Cybersecurity Certified (CSC) NEW
    • Code Score Matrix NEW
    • Long-term storage of wafers
    • Electronic Design
  • Tools
    • Comparator
    • MYDCLs / BOMs
    • esa-stockplace
  • About Us
  • Proposal Next
  • Sign In
Cookies on the doEEEt website. We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on the doEEEt website. However, if you would like to, you can change your cookie settings at any time. Link to cookies policy.
doEEEt Bond Pull Test for AD Converters | doEEEt.com
  • Home
  • How does doEEEt works
  • About us
  • Contact Us
  • Terms of Use
  • Disclaimer
  • Privacy Policy
  • Privacy Policy and Legal Notice
  • Cookie Policy
  • Copyright
  • autosignup2
  • Instant Quote
  • Introducing NanoXplore And Its European FPGA’s ITAR Free
  • Space Talks 3 - Dan Friedlander
  • autosignup3
  • Shopping Cart
  • wpo
  • Data Protection
  • Components
  • Documents
Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

Bond Pull Test for AD Converters

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

Related content

X-Ray Inspection applied to DPA test

Non-destructive internal inspection of EEE parts and passive components

electrical testing

Alter Technology SAM Additional Testing Capabilities

procurement-EEE-Parts

Reasons to do an Element Evaluation Procedure of EEE Parts

EEE Parts Results Page

Bond Pull Test for AD Converters

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close
  • Microcircuits
    • Signal Acquisition-Conditioning
      • Data Converter
        • Analog to Digital Converters

478 results found for Analog to Digital Converters/Data Converter/Signal Acquisition-Conditioning/Microcircuits

Reset
Part reference
Quality level / QPL
TOP
Package
Unit price
Lead time

ADC128S102CIMT/NOPB
ADC128S102CIMT/NOPB
Texas Instruments
MFR DS SNAS298

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
GOLD
-40ºC to +105ºC
Surface Mount
TSSOP-16

AD9042ASTZ
AD9042ASTZ
Analog Devices
MFR DS AD9042

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
LQFP-44

AD7961BCPZ
AD7961BCPZ
Analog Devices
MFR DS AD7961

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
LFCSP-32

AD7982BCPZ
AD7982BCPZ
Analog Devices
MFR DS AD7982

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
LFCSP-10

AD7621ASTZ
AD7621ASTZ
Analog Devices
MFR DS AD7621

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
LQFP-48

LTC2449IUHF#PBF
LTC2449IUHF#PBF
Linear Technology
MFR DS LTC2444/2445/2448/2449

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
QFN-38

AD7872BRZ
AD7872BRZ
Analog Devices
MFR DS AD7871/AD7872

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
SOIC-16

5962-9169101QXC
5101A-SD8B
XTREME Semiconductor
5962-91691

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28

MX674ATQ/883B
MX674ATQ/883B
Maxim
MFR DS MX674_883B

Compare DCL / BOM Cart
883
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Through Hole Mount
CDIP-28

5962-9225302HXA
MN6450SMXA
Spectrum Microwave Inc
5962-92253

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-32
Part validation activities
Cost & Activity Matrix
  • <
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • >
Alter Technology Laboratory Services
  • Screening
  • Evaluation/Qualification
  • Scanning Acoustic Microscopy
  • RF/Microwave
  • Incoming Inspection
  • DPA

EEE Components
  • Capacitors
  • Microcircuits
  • Resistors
  • Crystals and Oscillators
  • Schottky Barrier Rectifiers
  • Discretes

Laboratory Success Cases
  • GRACE Project
  • XRAY, SAM and Cross Section
  • SiC schottky Diode
  • JUICE Case
  • Deimos Neptuno
  • Melissa III

Company
  • About Us
  • Contact-us
  • How does doEEEt works?
Security & Privacity
  • Privacy Policy and Legal Notice
  • Copyright
  • Contact Clause
  • LinkedIn LinkedIn
  • Twitter Twitter
Copyright © 2025 ALTER TECHNOLOGY TÜV NORD S.A.U
All rights reserved.