Skip to Content
  • Resources
    • COTS For Space WEBINARS
    • EEE Components
    • SPECIFICATIONS / QPLs
    • Events / Webinars
    • Space Talks
    • Tech Articles
    • Manufacturer Notifications
  • Laboratory Services
    • Laboratory Standard Testing
    • Non Standard Testing
    • Silicon Carbide -SiC- Diodes
    • CrowdTesting
    • Optoelectronics
    • Small Sats
    • Representative Projects / Papers
  • Additional Services
    • Industry 4.0 Cybersecurity (IEC 62443) NEW
    • Penetration Test NEW
    • Cybersecurity Certified (CSC) NEW
    • Code Score Matrix NEW
    • Long-term storage of wafers
    • Electronic Design
  • Tools
    • Comparator
    • MYDCLs / BOMs
    • esa-stockplace
  • About Us
  • Proposal Next
  • Sign In
Cookies on the doEEEt website. We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on the doEEEt website. However, if you would like to, you can change your cookie settings at any time. Link to cookies policy.
doEEEt Cross Sectioning for 1553 Transceivers | doEEEt.com
  • Home
  • How does doEEEt works
  • About us
  • Contact Us
  • Terms of Use
  • Disclaimer
  • Privacy Policy
  • Privacy Policy and Legal Notice
  • Cookie Policy
  • Copyright
  • autosignup2
  • Instant Quote
  • Introducing NanoXplore And Its European FPGA’s ITAR Free
  • Space Talks 3 - Dan Friedlander
  • autosignup3
  • Shopping Cart
  • wpo
  • Data Protection
  • Components
  • Documents
Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

Cross Sectioning for 1553 Transceivers

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

Related content

Microsection images.

Test combination for detecting defects in plastic ICs

Importance of SAM for delamination detection

Importance of the SAM for delamination detection

C-Sam-internal-inspection-

SAM Capabilities, Analyse the internal structure in EEE Parts

Microsection Inspection - Failure Analysis

Failure Analysis in Microsection Inspection

Constructional Analysis

Constructional Analysis in Microsection Inspection

EEE Parts Results Page

Cross Sectioning for 1553 Transceivers

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close
  • Microcircuits
    • Communication-Interface
      • 1553

907 results found for 1553/Communication-Interface/Microcircuits

Reset
Part reference
Quality level / QPL
TOP
Package
Protocol Compatible
Type
TID (krads)
SEE (MeV/mg/cm2)
Number of Channels
Unit price
Lead time

5962-8952210XA
NHI-1559/883
National Hybrid
5962-89522

Compare DCL / BOM Cart
QML H
Not qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-36
Transceiver
2

5962-8952204XA
NHI-1559/883
National Hybrid
5962-89522

Compare DCL / BOM Cart
QML H
Not qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-36
Transceiver
2

5962-8982607XC
FC1553722
API Technologies RF2M Division
5962-89826

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-36
Driver/Receiver
2

5962-8604908XA
FC155362
API Technologies RF2M Division
5962-86049

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
Hybrid DIP-24
Driver/Receiver
1

5962-8952206KYC
FC1553921FP
API Technologies RF2M Division
5962-89522

Compare DCL / BOM Cart
QML K
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CFP-36
Transceiver
2

5962-9553901HYC
RTM1760-PGA
API Technologies RF2M Division
5962-95539

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CPGA-100
1553,1760
Transceiver
2

5962-8952209YA
FC1553922FP
API Technologies RF2M Division
5962-89522

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CFP-36
Transceiver
2

5962-8952201YC
NHI-1559FP/883
National Hybrid
5962-89522

Compare DCL / BOM Cart
QML H
Not qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CFP-36
Transceiver
2

DTR5V
DTR5V 1553 dual transceiver
Airbus Defence and Space
MFR DS DPN-A5-ST-0426

Compare DCL / BOM Cart
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
FP-46

A0000055(H757)
A0000055(H757) 1553 dual transceiver
Airbus Defence and Space
MFR DS DPN-A5-ST-0426

Compare DCL / BOM Cart
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
FP-64
Part validation activities
Cost & Activity Matrix
  • <
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • >
Alter Technology Laboratory Services
  • Screening
  • Evaluation/Qualification
  • Scanning Acoustic Microscopy
  • RF/Microwave
  • Incoming Inspection
  • DPA

EEE Components
  • Capacitors
  • Microcircuits
  • Resistors
  • Crystals and Oscillators
  • Schottky Barrier Rectifiers
  • Discretes

Laboratory Success Cases
  • GRACE Project
  • XRAY, SAM and Cross Section
  • SiC schottky Diode
  • JUICE Case
  • Deimos Neptuno
  • Melissa III

Company
  • About Us
  • Contact-us
  • How does doEEEt works?
Security & Privacity
  • Privacy Policy and Legal Notice
  • Copyright
  • Contact Clause
  • LinkedIn LinkedIn
  • Twitter Twitter
Copyright © 2025 ALTER TECHNOLOGY TÜV NORD S.A.U
All rights reserved.