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Bond Pull Test for 1553 Transceivers
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for 1553 Transceivers
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
907 results found for 1553/Communication-Interface/Microcircuits
Part reference
Quality level / QPL
Package
Protocol Compatible
Type
TID (krads)
SEE (MeV/mg/cm2)
Number of Channels
Unit price
Lead time
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-36
Transceiver
2
QML H
Not qualified
QPDSIS-38534
Through Hole Mount
CDIP-20
Transceiver
2
QML H
Qualified
QPDSIS-38534
Through Hole Mount
Hybrid DIP-24
Driver/Receiver
1
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-36
Driver/Receiver
2
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-24
Driver/Receiver
1
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-24
Driver/Receiver
1
QML H
Not qualified
QPDSIS-38534
Surface Mount
CFP-36
Transceiver
2
QML H
Qualified
QPDSIS-38534
Surface Mount
CFP-36
Driver/Receiver
2
QML H
Not qualified
QPDSIS-38534
Through Hole Mount
CDIP-24
Driver/Receiver
1
QML H
Not qualified
QPDSIS-38534
Surface Mount
CFP-36
Transceiver
2
Part validation activities
Cost & Activity Matrix