125 results found for MIL-STD-88
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This test method is performed to determine whether termination leads and other component parts can withstand the effects of the heat to which they will be subjected...
DLA
Method
1 /
Active
The purpose of this test is to detect loose particles inside a device cavity. The test provides a nondestructive means of identifying those devices containing...
DLA
Method
9 /
Active
The purpose of this test procedure is to measure small signal power gain and the noise figure of an amplifier.
DLA
Method
2 /
Active
This test procedure defines the requirements for testing the response of packaged digital integrated circuits to pulsed ionizing radiation.
DLA
Method
3 /
Active
The purpose of this method is to reveal nonacceptable wire bonds while avoiding damage to acceptable wire bonds.
DLA
Method
7 /
Active
The purpose of this examination is to nondestructively detect unbonded regions, delaminations and/or voids in the die attach material and at interfaces within devices...
DLA
Method
2 /
Active
The purpose of preseal burn-in is to identify marginal devices or stabilize monolithic, hybrid, or multichip microcircuits prior to the sealing of packages so that...
DLA
Method
2 /
Active
This method establishes the means of measuring the level of cross-coupling of wideband digital signals and noise between pins in a digital microcircuit package.
DLA
Method
/
Active
The purpose of this test is to inspect passive elements used for microelectronic applications, including RF/microwave, for the visual defects described herein.
DLA
Method
3 /
Active
This method establishes the means for assuring device performance to the limits specified in the applicable acquisition document in regard to input and output...
DLA
Method
1 /
Active