40 results found for MIL-STD-202
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This test is conducted for the purpose of detecting contact-chatter in electrical and electronic component parts having movable electrical contacts, such as relays,...
DLA
Method
/
Active
The purpose of this test is to detect the presence of free moving particulate contaminants within sealed cavity devices. This test method is specifically directed...
DLA
Method
/
Active
This test is performed to determine whether wire and other component parts can withstand the effects of the heat to which they will be subjected during the soldering...
DLA
Method
/
Active
This test determines the ability of component parts and subassemblies of electrical and electronic components to withstand shocks.
DLA
Method
/
Cancelled
This test is performed for the purpose of determining the effects of acceleration stress on component parts, and to verify the ability of the component parts to...
DLA
Method
/
Active
Radiographic inspection is generally a nondestructive (see 1.2) method for detecting internal physical defects in small component parts which are not otherwise visible.
DLA
Method
A /
Active
This test determines the ability of component parts and subassemblies of electrical and electronic components to withstand shocks.
DLA
Method
E /
Canceled
This test is conducted for the purpose of determining the effects on electrical and mechanical characteristics of a part, resulting from exposure of the part to an...
DLA
Method
/
Active
The purpose of this test method is to determine the solderability of all terminations which are normally joined by a soldering operation.
DLA
Method
A /
Active
It is the purpose of this test to determine the percentage change in direct-current (dc) ohmic resistance from the dc ohmic resistance at the reference temperature,...
DLA
Method
/
Active