NCCS 2CTDP201 Failure of one component stack into 3D PLUS 8Mb MRAM module

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Root cause is pointing on a bad intermetallic compound on ball bonding located inside TSOP 5 on a stack of 8 TSOP. It happened on tow modulses P/N 3DMR8M08VS8666 SS R ML DC2111. The two failed TSOP are issued by the component lot DC1843-S65.
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