MIL-STD-750, Method 3100 Transistor Electrical Test Methods for semiconductor Devices Part 3: Test Method Junction temperature measurement at burn-in and life test
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This purpose of this test is to verify a desired junction temperature (TJ) is achieved during burn-in and life-test environments, and is conducted on a representative sample of devices.
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09/12/2019 0:00:00
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MIL-STD-750, Method 3100
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