MIL-STD-750, Method 2073 Mechanical Test Methods for Semiconductor Devices Part 2: Visual inspection for die (semiconductor diode)
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The purpose of this test method is to check the quality and workmanship of semiconductor die for compliance with the requirements of the individual specification sheet.
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MIL-STD-750, Method 2073
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MIL-STD-750, Method 2073
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