MIL-STD-750, Method 2031 Mechanical Test Methods for Semiconductor Devices Part 2: Resistance to soldering heat
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This test method is performed to determine whether semiconductor device terminations can withstand the effects of the heat to which they will be subjected during the soldering process (solder iron, solder dip, solder wave, or solder reflow).
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MIL-STD-750, Method 2031
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