MIL-STD-750, Method 2103 Mechanical Test Methods for Semiconductor Devices Part 2: Design verification for surface mount devices
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The purpose of this test is to qualify the ability of a surface mount package of a semiconductor device to withstand the stresses developed by a thermal mismatch (due to differences in thermal expansion properties) between a standard printed board substrate and the device under evaluation.
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MIL-STD-750, Method 2103
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MIL-STD-750, Method 2103
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