MIL-STD-750, Method 2005 Mechanical Test Methods for Semiconductor Devices Part 2: Axial lead tensile test
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The purpose of this test method is to establish the capability of axial lead glass body diodes to be free of intermittents or opens when measured in the forward mode under conditions of tensile stress and controlled temperature. This test may be destructive.
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MIL-STD-750, Method 2005
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MIL-STD-750, Method 2005
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