MIL-STD-750, Method 2026 Mechanical Test Methods for Semiconductor Devices Part 2: Solderability
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The purpose of this test method is to provide a referee condition for the evaluation of the solderability of terminations (including leads up to .125 inch (3.18 mm) in diameter) that will be assembled using tin lead eutectic solder.
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MIL-STD-750, Method 2026
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MIL-STD-750, Method 2026
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