IPCN23597X Conversion of select ON Semiconductor, Czech Republic (Roznov) wafer fab technologies from 150mm to 200mm wafer diameter

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With the purpouse of increasing wafer fab productivity, a 200mm wafer process is being created at Roznov in order to get the same electrical and reliability performances as the 150mm process. This is a change diameter only; there will be no changes to assembly or test locations as a result of this changed
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