MIL-STD-883, Method 2021 Mechanical Test Method Standard for Microcircuits: Glassivation layer integrity
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The purpose of this test is to assess the structural quality of deposited dielectric films (e.g., CVD, sputtered or electron beam evaporated glass or nitride, etc.) over aluminum metallized semiconductor devices or microcircuits.
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16/09/2019 0:00:00
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MIL-STD-883, Method 2021
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