Scanning Acoustic Microscopy (SAM) enables high-resolution, non-destructive imaging of internal structures and defects in layered systems.
Scanning Acoustic Microscopy (SAM) for deep internal inspection
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EEE Testing
Inside the package: Scanning Acoustic Microscopy (SAM) in EEE inspection
SAM enables non-destructive internal inspection of microelectronic parts by analyzing acoustic wave reflections and contrasts.
Understanding the use of Thermoreflectance Thermal Imaging (TTI)
Thermoreflectance Thermal Imaging (TTI) maps micro-scale temperature gradients in devices with high spatial and temporal resolution.
Why XPS is essential for surface and interface studies
XPS provides precise, non-destructive surface analysis of thin films, revealing elemental composition at nanometer-scale depth.
Looking at device internal structure by a cross-sectioning
Cross-sectioning reveals internal structures and defects in components through precise grinding and polishing.
Coating thickness measurement with X-Ray Fluorescence (XRF)
X-ray fluorescence enables non-destructive measurement of coating thickness with high precision and reliability.
Importance of the SAM for delamination detection
Delamination detection using acoustic microscopy reveals internal defects in plastic components, crucial for high-reliability applications.
ALTER’s role in making space components reliable
Space applications demand fault-free electronic components tested for extreme conditions to ensure long-term satellite reliability.
Temperature and Humidity Test of electronic components
Humidity test evaluates component reliability by exposing devices to moisture and heat to reveal potential failures or degradation.
Evaluation of delaminations in space COTS components
Delaminations in COTS components can lead to mechanical and electrical failures, making inspection essential for space use.
Identifying leakage pathway with a penetrant dye gross leak test
Leakage pathway detection uses dye tests to reveal cracks or voids compromising device reliability and sealing.
What is an External Visual Inspection?
External visual inspection checks EEE parts for defects or damage using optical tools, ensuring compliance with standards.
Evaluation of optical switches without moving parts
Non-mechanical optical switches show strong potential for space use, with B-EO and MO technologies performing reliably.
Radiation-resistant Photonics Integrated Circuits
Photonic integrated circuits offer radiation-resistant solutions for data, sensing, and space-based communication systems.
Long-term storage of EEE components at ALTER
Long term storage of EEE components requires strict controls on environment, handling, and packaging to avoid degradation.
Main changes in ECSS-Q-ST-60-14C Relifing procedure
ECSS-Q-ST-60-14C outlines relifing rules for stored EEE parts, ensuring their suitability for space applications over time.
External Visual Inspection Guidelines
External visual inspection ensures EEE parts quality by identifying critical features and common issues in FPGAs and components per MIL-STD-883 Method 2009.
C-SAM crack detection within plastic packages
Scanning Acoustic Microscopy enables reliable crack detection in plastic packages, preventing failures in electronic components.
Incoming Inspection for non-conforming parts
Incoming inspection ensures part quality by checking materials for non-conformance before inventory or production use.
Burn-In Test boosts electronic reliability
Burn-in test screens electronics for early failures, removing defective parts to ensure long-term reliability and product quality.