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Scanning Acoustic Microscopy (SAM) enables precise detection of critical solder delamination in power modules. This study reveals how internal solder defects exceeding 50% contact loss compromise thermal performance and reliability, as defined by the J-STD-020E standard.
C-SAM analysis is a non-destructive inspection method used to detect internal defects in capacitors, such as voids, cracks, and delaminations. At Alter Technology, we apply this technique to ensure reliability, prevent premature failures, and guarantee the highest quality before component assembly.
Explore this technical note on how false delaminations and adhesions can significantly impact the reliability of acoustic inspections.
Explore this technical note presenting an Inspection Reveals Critical Delamination in Dual Switching Diode
The GRACE project develops SiC radiation sensors for plasma diagnostics, tested at 500°C to ensure fusion reactor suitability.
HV optocouplers require thermal vacuum testing to ensure isolation reliability, as vacuum can affect internal gel stability and performance.
SiC diodes offer high-performance switching for space use, with radiation effects manageable through proper testing and bias control.
Radiation effects on electronics include cumulative damage (TID, TNID) and transient failures (SEE), requiring irradiation testing.
TID test standards define irradiation methods, dose rates, and handling to assess component tolerance to total ionizing dose.
Radiation affects EEE components in space through TID, displacement damage, and single event effects, impacting mission reliability.
Radiation analysis documents component tolerance to space radiation, ensuring compliance with mission-specific exposure levels.
A product assurance plan defines quality, reliability, and component requirements to ensure mission success in New Space projects.
Non-volatile memories retain data without power; endurance and data retention are key for space-grade reliability.
DPA ensures quality and reliability of EEE components by examining design and workmanship through detailed physical analysis.
ASIC design focuses on custom integrated circuits for specific functions, with added complexity for space applications.
Electrical test of operational amplifiers monitors key parameters to assess performance under space-related stress conditions.
JUICE mission tested optical fibers under cryogenic cycles to ensure performance for data transfer from Jupiter’s icy moons.
Mars Curiosity rover uses UV photodiodes to monitor surface radiation and support future mission planning.
Strain gages are tested in extreme temperatures and vacuum to assess deformation behavior in critical structures.
Bond pull test assesses bond strength and reliability under stress to ensure compliance with manufacturing standards.