Overview of mechanical stress methods for lead integrity test in electronic parts, based on MIL-STD-883 and advanced force/fatigue tools.
Lead integrity test methods
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What is a life test in electronic components?
Life test applies electrical stress to reveal wear-out failures and assess long-term device reliability performance.
Advantages of SAM for new space microelectronics inspection
New space microelectronics benefit from SAM’s non-destructive defect imaging in complex, high-reliability components.
Electrical characterization of 1.2kV SiC Schottky diode at a wide temperature range
Electrical characterization of SiC diodes shows reliable performance under high temperatures and varying voltage conditions.
Comparison of rejection criteria in SAM inspection standards
Comparison of SAM rejection criteria across IPC, ESCC, MIL-STD, and NASA specs for cracks, voids, delamination, and contamination.
Water ingress through delaminated parts in plastic encapsulated systems
Scanning acoustic microscopy (SAM) detects water ingress paths and hidden flaws in delaminated parts of microelectronic systems.
XRF tool for advanced material analysis
XRF tool enables fast, non-destructive analysis of materials in aerospace and electronics for compliance and quality control.
Integrated SAM and stress testing protocols
Combined SAM and stress testing protocols to improve flaw detection and reliability in microelectronic space components.
When to use the Focused Ion Beam (FIB) micro-sectioning technique
Focused ion beam enables precise material removal and analysis in microelectronics and failure investigations.
C-SAM inspection of stacked capacitor lead frames
C-SAM inspection reveals interface anomalies in horizontally stacked capacitors by using high-frequency acoustic imaging.
Inspection of thick plastic encapsulated parts
Thick plastic encapsulated parts require multi-depth confocal imaging to detect delamination, voids, and internal structural defects.
Verifying the structural quality of the glassivation layer
Glassivation layer testing ensures dielectric integrity over aluminum to prevent defects like cracks, pinholes, and electromigration.
Reliability challenges in plastic encapsulated microcircuits
Plastic encapsulated parts pose risks like delamination and voids; SAM detects internal flaws non-destructively with high sensitivity.
Material analysis techniques for electronic components
Material analysis identifies elements in microelectronic parts to ensure compliance, reliability, and detection of prohibited materials.
Ultrasonic examination of ceramic capacitors by Scanning Acoustic Microscopy (SAM)
Ultrasonic examination detects submicron internal defects in ceramic capacitors, ensuring reliability through non-destructive analysis.
How to protect your COTS parts during C-SAM inspections
COTS parts undergo safe C-SAM inspection using deionized water, limited immersion, and drying to prevent corrosion and damage.
What is decapsulation of packaged devices?
Decapsulation exposes internal device structures for analysis of die, interconnects, and defects during failure investigations.
Hermeticity testing techniques: seal test, fine & gross leak
Hermeticity testing detects seal integrity in components to prevent contamination and ensure long-term device reliability.
What is a C-SAM Inspection?
C-SAM inspection reveals internal defects like voids and delamination in encapsulated microelectronic components with precision.
How C-SAM ensures reliability in Space, Defense, and Automotive
C-SAM enables non-destructive inspection of microelectronic parts, detecting internal defects across critical applications.