C-SAM inspection reveals internal defects like voids and delamination in encapsulated microelectronic components with precision.
What is a C-SAM Inspection?
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Material and Processes Testing
How C-SAM ensures reliability in Space, Defense, and Automotive
C-SAM enables non-destructive inspection of microelectronic parts, detecting internal defects across critical applications.
Scanning Acoustic Microscopy (SAM) for deep internal inspection
Scanning Acoustic Microscopy (SAM) enables high-resolution, non-destructive imaging of internal structures and defects in layered systems.
Inside the package: Scanning Acoustic Microscopy (SAM) in EEE inspection
SAM enables non-destructive internal inspection of microelectronic parts by analyzing acoustic wave reflections and contrasts.
Understanding the use of Thermoreflectance Thermal Imaging (TTI)
Thermoreflectance Thermal Imaging (TTI) maps micro-scale temperature gradients in devices with high spatial and temporal resolution.
Why XPS is essential for surface and interface studies
XPS provides precise, non-destructive surface analysis of thin films, revealing elemental composition at nanometer-scale depth.
Looking at device internal structure by a cross-sectioning
Cross-sectioning reveals internal structures and defects in components through precise grinding and polishing.
Coating thickness measurement with X-Ray Fluorescence (XRF)
X-ray fluorescence enables non-destructive measurement of coating thickness with high precision and reliability.
Importance of the SAM for delamination detection
Delamination detection using acoustic microscopy reveals internal defects in plastic components, crucial for high-reliability applications.
Evaluation of delaminations in space COTS components
Delaminations in COTS components can lead to mechanical and electrical failures, making inspection essential for space use.
C-SAM crack detection within plastic packages
Scanning Acoustic Microscopy enables reliable crack detection in plastic packages, preventing failures in electronic components.
Using a fluorescence microscopy + dye penetrant test on EEE parts
Fluorescence microscopy detects cracks and defects with high sensitivity, enhancing failure analysis in high-reliability electronics.
Microsectioning sample preparation of PCB systems
Microsectioning enables internal inspection of EEE parts, revealing structural defects in PCBs per ESA and industry qualification standards.
Plated Through Via (PTV) manufacturing defects
Plated Through Via (PTV) reliability depends on plating thickness, voids, and cracks; cross-section analysis ensures structural integrity.
NASA reports and evaluates MLCC cracking issues at low voltage
MLCC reliability in space systems is challenged by cracking, often from soldering stress; design and screening help mitigate failures.
Fundamentals of solderability and testing methods
Solderability refers to how well a surface can be wetted by solder, assessed through visual or force-based test methods.
MIL-STD-883 2003: Solderability Test procedure
MIL-STD-883 defines solderability testing via Dip and Look to assess termination quality after steam aging and solder dipping.
Inspecting plastic COTS: Your questions answered
Explore expert answers on non-destructive inspection techniques for plastic COTS parts using SAM in this Q&A recap.
Non-destructive inspection of plastic COTS parts and beyond
Non-destructive inspection using acoustic microscopy enhances reliability screening of plastic COTS and electronic systems.
CSAM inspection: Common questions and expert answers
Get expert answers to key questions on CSAM inspections, water use, delamination, and EEE package reliability.