Non-volatile memories retain data without power; endurance and data retention are key for space-grade reliability.
Endurance and data retention in non-volatile memories
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Material and Processes Testing
Complying with DPA requirements for space projects
DPA ensures quality and reliability of EEE components by examining design and workmanship through detailed physical analysis.
Radiographic X-Ray Inspection
X-ray inspection reveals internal defects in components using non-destructive 2D and 3D imaging techniques.
Objectives and methods of Thermal Cycling Testing
Thermal cycling testing assesses component durability under repeated extreme temperatures to identify thermal stress failures.
Non-Destructive test methods for EEE components
Comparison of non-destructive test methods like X-ray, SAM, and lock-in IR used to inspect EEE components and detect internal defects.
Advantages of SAM for new space microelectronics inspection
New space microelectronics benefit from SAM’s non-destructive defect imaging in complex, high-reliability components.
Comparison of rejection criteria in SAM inspection standards
Comparison of SAM rejection criteria across IPC, ESCC, MIL-STD, and NASA specs for cracks, voids, delamination, and contamination.
Water ingress through delaminated parts in plastic encapsulated systems
Scanning acoustic microscopy (SAM) detects water ingress paths and hidden flaws in delaminated parts of microelectronic systems.
XRF tool for advanced material analysis
XRF tool enables fast, non-destructive analysis of materials in aerospace and electronics for compliance and quality control.
Integrated SAM and stress testing protocols
Combined SAM and stress testing protocols to improve flaw detection and reliability in microelectronic space components.
When to use the Focused Ion Beam (FIB) micro-sectioning technique
Focused ion beam enables precise material removal and analysis in microelectronics and failure investigations.
C-SAM inspection of stacked capacitor lead frames
C-SAM inspection reveals interface anomalies in horizontally stacked capacitors by using high-frequency acoustic imaging.
Inspection of thick plastic encapsulated parts
Thick plastic encapsulated parts require multi-depth confocal imaging to detect delamination, voids, and internal structural defects.
Verifying the structural quality of the glassivation layer
Glassivation layer testing ensures dielectric integrity over aluminum to prevent defects like cracks, pinholes, and electromigration.
Reliability challenges in plastic encapsulated microcircuits
Plastic encapsulated parts pose risks like delamination and voids; SAM detects internal flaws non-destructively with high sensitivity.
Material analysis techniques for electronic components
Material analysis identifies elements in microelectronic parts to ensure compliance, reliability, and detection of prohibited materials.
Ultrasonic examination of ceramic capacitors by Scanning Acoustic Microscopy (SAM)
Ultrasonic examination detects submicron internal defects in ceramic capacitors, ensuring reliability through non-destructive analysis.
How to protect your COTS parts during C-SAM inspections
COTS parts undergo safe C-SAM inspection using deionized water, limited immersion, and drying to prevent corrosion and damage.
What is decapsulation of packaged devices?
Decapsulation exposes internal device structures for analysis of die, interconnects, and defects during failure investigations.
Hermeticity testing techniques: seal test, fine & gross leak
Hermeticity testing detects seal integrity in components to prevent contamination and ensure long-term device reliability.