Precision resistor selection ensures accurate current sensing and reliability in high-performance aerospace systems.
Current flow measurement using precision resistors
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Application
Prototyping a 1.2kV SiC Schottky diode for TWTAs
1.2kV SiC Schottky diode enables efficient, compact, and high-reliability power systems for space applications.
Electrical characterization of 1.2kV SiC Schottky diode at a wide temperature range
Electrical characterization of SiC diodes shows reliable performance under high temperatures and varying voltage conditions.
The changing approach to space parts selection
Explore evolving definitions of rad-hard components and how radiation effects shape semiconductor selection in modern satellite systems.
Rad-hard parts available in the market
Explore rad-hard, enhanced, and commercial strategies for satellite design and how each balances cost, risk, and radiation resilience.
SRAM design strategies for space systems
This article explores five SRAM memory design approaches for achieving a 16 Mbit memory bank in space systems, comparing traditional...
Comparison of rejection criteria in SAM inspection standards
Comparison of SAM rejection criteria across IPC, ESCC, MIL-STD, and NASA specs for cracks, voids, delamination, and contamination.
Water ingress through delaminated parts in plastic encapsulated systems
Scanning acoustic microscopy (SAM) detects water ingress paths and hidden flaws in delaminated parts of microelectronic systems.
Integrated SAM and stress testing protocols
Combined SAM and stress testing protocols to improve flaw detection and reliability in microelectronic space components.
When to use the Focused Ion Beam (FIB) micro-sectioning technique
Focused ion beam enables precise material removal and analysis in microelectronics and failure investigations.
C-SAM inspection of stacked capacitor lead frames
C-SAM inspection reveals interface anomalies in horizontally stacked capacitors by using high-frequency acoustic imaging.
Inspection of thick plastic encapsulated parts
Thick plastic encapsulated parts require multi-depth confocal imaging to detect delamination, voids, and internal structural defects.
Reliability challenges in plastic encapsulated microcircuits
Plastic encapsulated parts pose risks like delamination and voids; SAM detects internal flaws non-destructively with high sensitivity.
How to protect your COTS parts during C-SAM inspections
COTS parts undergo safe C-SAM inspection using deionized water, limited immersion, and drying to prevent corrosion and damage.
What is a C-SAM Inspection?
C-SAM inspection reveals internal defects like voids and delamination in encapsulated microelectronic components with precision.
How C-SAM ensures reliability in Space, Defense, and Automotive
C-SAM enables non-destructive inspection of microelectronic parts, detecting internal defects across critical applications.
Scanning Acoustic Microscopy (SAM) for deep internal inspection
Scanning Acoustic Microscopy (SAM) enables high-resolution, non-destructive imaging of internal structures and defects in layered systems.
Inside the package: Scanning Acoustic Microscopy (SAM) in EEE inspection
SAM enables non-destructive internal inspection of microelectronic parts by analyzing acoustic wave reflections and contrasts.
Looking at device internal structure by a cross-sectioning
Cross-sectioning reveals internal structures and defects in components through precise grinding and polishing.
Coating thickness measurement with X-Ray Fluorescence (XRF)
X-ray fluorescence enables non-destructive measurement of coating thickness with high precision and reliability.