QPL 236 updates include extensions for Vishay resistors, Gore cables, and STMicroelectronics MOSFETs and transistors, plus a MOSFET revision.

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QPL 236 updates include extensions for Vishay resistors, Gore cables, and STMicroelectronics MOSFETs and transistors, plus a MOSFET revision.
ESCC QPL 234 updates include extensions for Exxelia, Gore, and STMicroelectronics, a re-scope for REL STPI relays, and diode revisions.
QPL 232 updates include revisions for C&K connectors, extensions for Schurter fuses, a remark for Rakon oscillators, and edits for capacitors.
ESCC QPL 235 updates include extensions for Souriau, Axon, and Comepa, a revision for Exxelia capacitors, and Minco heater removal.
ESCC QPL 231 adds Axon’s RF cable assembly, extends Souriau connectors and Kyocera capacitors, and revises Exxelia power inductors.
ESCC QPL 237 updates include extensions for cables and resistors, a re-scope for Microchip’s SAMRH71, and the removal of Nexans certificates.
ESCC QPL 239 updates include extensions for capacitors, resistors, and cable assemblies, plus a re-scope for Radiall’s TNC-VHP cables.
ESCC QPL 248 introduces UMS GH50-20 GaN HEMT technology, enhancing efficiency, durability, and performance for space applications.
ESCC QPL 249 updates include extensions for Radiall, Gore, and Exxelia certificates, plus rescopes and changes to Space IC’s specifications.
ESCC QPL 246 introduces new certifications like Axon’Cable’s high data rate assemblies and extends key certificates for space-grade components.
ESCC QPL 247 introduces new certificates like IMST’s RF/Mixed Signal ASICs and extends certifications, ensuring robust space-grade components.
Edition 251 of the ESCC QPL introduces updates like certificate extensions for SAW filters and removals affecting key suppliers.
Acceleration tests assess equipment reliability under fixed acceleration stress, simulating conditions in aircraft and missiles.
Static magnetic field tests ensure accurate calibration of space equipment by generating uniform, adjustable magnetic fields.
The article discusses the application of CSAM in detecting internal defects, such as air gaps and cracks, within high-voltage multilayer ceramic capacitors (MLCCs).
Failure analysis (FA) is essential for identifying root causes in passive component malfunctions, enhancing system reliability.
QPL 250 highlights new ESCC-qualified radiation-hardened ASICs, FPGAs, microprocessors, and LVDS drivers for space applications.
Plastic encapsulation offers a cost-effective solution for medium-volume semiconductor assembly, addressing aerospace, space, and industrial needs.
ESCC QPL 230 updates include new certifications, scope extensions, and revisions for ESCC-qualified space components.
ESCC EPPL 45 updates add radiation-hardened ASICs, FPGAs, microprocessors, and high-speed LVDS drivers, enhancing space component options.