This webinar provides a brief overview of Scanning Acoustic Microscopy and the inspection of EEE parts. Thus, you will acquire, in a friendly way, the knowledge to interpret SAM images and to conceive basic SAM inspections. The webinar is mainly focused on the plastic encapsulated systems. In addition, we will also show other interesting application examples.
The webinar addresses the following questions:
- Which type of defects and anomalies can be detected by this non-destructive technique?
- Scanning modes. (C-SAM, T-SAM, A-SAM, B-SAM, Depth analysis …).
- What are they used for?
- Which type of information can we get for each type of inspection?
- How to understand C-SAM images and results?
- What do red/yellow areas mean?
- Peak amplitude and phase inversion analysis.
- How to recognize delamination and voids?.
- Limit of the technique. Can we image sub-millimetric chip-scale packages? (SOD 323, SOD 923, …)
- Beyond plastic packages. Is the technique used for the inspection of other systems?
- Capacitors
- Hermetic packages
- Flip-chips
- PCBs
- Chips on boards
- Assembled structures
Francisco J. Aparicio
Francisco J. Aparicio is a physicist with a Ph.D. in Materials Science, specializing in non-destructive testing and failure analysis of electronic components. With a strong academic and research background, he has held positions at institutions such as the University of Trento, University of Mons, and the Spanish National Research Council. His current focus is on advanced inspection techniques, particularly Scanning Acoustic Microscopy, applied to EEE components in high-reliability sectors.
