Servicio Familia 
Bond Pull Test for Voltage Frequency Converter
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Voltage Frequency Converter
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
9 results found for Voltage to Frequency/Data Converter/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
883
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
883
Qualified
QPDSIS-38535
Through Hole Mount
TO-100
883
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
883
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
QML V
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
SPACE
Not qualified
ADI Space QPL
Through Hole Mount
CDIP-14
QML Q
Not qualified
QPDSIS-38535
Through Hole Mount
TO-99
883
Qualified
QPDSIS-38535
Through Hole Mount
TO-100
Part validation activities
Cost & Activity Matrix