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Bond Pull Test for Varactor Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Varactor Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1448 results found for Varactor/RF-Microwave Diode/Diode/Discretes
Part reference
Quality level / QPL
Package
Power Dissipation [Max]
TID (krads)
Forward Current [Max]
Total Capacitance [Max]
Working Peak Reverse Voltage [Max]
Unit price
Lead time
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
DO-204AA (DO-7)
18,9pF
30V
JANTXV
Not qualified
QPDSIS-19500
Through Hole Mount
DO-204AA (DO-7)
40,95pF
30V
JANTXV
Not qualified
QPDSIS-19500
Through Hole Mount
DO-204AA (DO-7)
47,94pF
30V
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DO-204AA (DO-7)
15,3pF
30V
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DO-204AA (DO-7)
6,94pF
30V
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DO-204AA (DO-7)
18,9pF
60V
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DO-204AA (DO-7)
15,7pF
60V
JANTXV
Not qualified
QPDSIS-19500
Through Hole Mount
DO-204AA (DO-7)
86,1pF
30V
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
DO-204AA (DO-7)
15,75pF
30V
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
DO-204AA (DO-7)