Servicio Familia 
Bond Pull Test for Source and Motor Drivers
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Source and Motor Drivers
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
47 results found for Source and Motor Drivers/Driver/Power Management/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Through Hole Mount
TO-220-11
QML V EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-132
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-20 (Gull Wing)
QML Q EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-132
QML V
Qualified
QPDSIS-38535
DIE
DIE
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-20
QML V
Qualified
QPDSIS-38535
Surface Mount
CQFP-132
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-132
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
HTSSOP-28
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
Part validation activities
Cost & Activity Matrix