


Bond Pull Test for Snap Action-Limit Switches
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Snap Action-Limit Switches
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
4076 results found for Snap Action-Limit Switches/Switches
Part reference
Quality level / QPL
Package
Contact Configuration
Rated Current
Unit price
Lead time
HIGH RELIABILITY STD.
Qualified
QPDSIS-8805
See Spec
HIGH RELIABILITY STD.
Qualified
QPDSIS-8805
See Spec
HIGH RELIABILITY STD.
Qualified
QPDSIS-8805
See Spec
HIGH RELIABILITY STD.
Qualified
QPDSIS-8805
See Spec
HIGH RELIABILITY STD.
Qualified
QPDSIS-8805
See Spec
HIGH RELIABILITY STD.
Qualified
QPDSIS-8805
See Spec
HIGH RELIABILITY STD.
Qualified
QPDSIS-8805
See Spec
HIGH RELIABILITY STD.
Qualified
QPDSIS-8805
See Spec
HIGH RELIABILITY STD.
Qualified
QPDSIS-8805
See Spec