Servicio Familia 
Bond Pull Test for Sample and Hold Amplifier
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Sample and Hold Amplifier
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
23 results found for Sample and Hold/Amplifier/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
SPACE
Not qualified
ADI Space QPL
Surface Mount
CFP-14
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-14 (Gull Wing)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
QML V
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
QML V
Not qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
JAN S
Not qualified
QPDSIS-38535
Through Hole Mount
TO-99
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-14
Part validation activities
Cost & Activity Matrix