Servicio Familia 
Bond Pull Test for RMS to DC Converters
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for RMS to DC Converters
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
8 results found for RMS to DC Converters/Power Management/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-14
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
TO-100
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
TO-100
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-14
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
Part validation activities
Cost & Activity Matrix