Servicio Familia 
Bond Pull Test for RF Low Noise Amplifier
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for RF Low Noise Amplifier
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
19 results found for Low Noise Amplifier -LNA-/RF Amplifiers/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOT-89-3
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-24
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
MSOP-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-16
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOT-363
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
LFCSP-6
SPACE
Not qualified
ADI Space QPL
Surface Mount
CQLCC-12
SPACE
Not qualified
ADI Space QPL
DIE
DIE
COMMERCIAL
Not qualified
NOT LISTED IN QPL
EVALUATED
Surface Mount
QFN-16
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-16
Part validation activities
Cost & Activity Matrix