Servicio Familia 
Bond Pull Test for RF Attenuator
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for RF Attenuator
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
14 results found for Attenuator/Control/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
MSOP-10
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-16
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-16
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-28 (Gull Wing)
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
LFCSP-24
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-28 (Gull Wing)
SPACE
Not qualified
ADI Space QPL
DIE
DIE
SPACE
Not qualified
ADI Space QPL
DIE
DIE
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
LFCSP-24
SPACE
Not qualified
ADI Space QPL
DIE
DIE
Part validation activities
Cost & Activity Matrix