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Bond Pull Test for Other Interfaces ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Other Interfaces ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
181 results found for Other Interfaces/Communication-Interface/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
MSOP-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-8
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
TO-99
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-14
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
883
Qualified
QPDSIS-38535
Not Available
Not Available
QML V
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
HTQFP-100
Part validation activities
Cost & Activity Matrix