Servicio Familia 
Bond Pull Test for MOS Capacitors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for MOS Capacitors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
188 results found for Semiconductor Capacitors/Capacitors
Part reference
Quality level / QPL
Package
Capacitance [Nom]
DC Rated Voltage
Tolerance
Unit price
Lead time
ESCC
Qualified
ESCC QPL
DIE
DIE
15pF
200V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
12pF
100V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
33pF
100V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
6,8pF
200V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
0,33pF
200V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
1pF
200V
±20%
ESCC
Qualified
ESCC QPL
DIE
DIE
10pF
40V
±20%
ESCC
Qualified
ESCC QPL
DIE
DIE
8,2pF
40V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
39pF
40V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
0,82pF
200V
±20%
Part validation activities
Cost & Activity Matrix