


DPA Test for Logic Switch ICs
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Logic Switch ICs
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
75 results found for Switch/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
Switch
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-48
Transceiver
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
Switch
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-20
Switch
TID (HDR): 100.0
SEL (Let): 100.0
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-48
Switch
TID (HDR): 100.0
SEL (Let): 100.0
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-48
Switch
TID (HDR): 100.0
SEL (Let): 100.0
ESCC
Not qualified
ESCC QPL
Surface Mount
CSOP-14
Switch
TID (HDR): 100.0
SEL (Let): 119.0
SEU (Let): 119.0
ESCC
Qualified
ESCC QPL
Surface Mount
CFP-14
ESCC
Qualified
ESCC QPL
Through Hole Mount
CDIP-14
Switch
TID (HDR): 100.0
SEL (Let): 119.0
SEU (Let): 119.0
ESCC
Qualified
ESCC QPL
Through Hole Mount
CDIP-14
Switch
TID (HDR): 100.0
SEL (Let): 119.0
SEU (Let): 119.0
Part validation activities
Cost & Activity Matrix