Servicio Familia 
Bond Pull Test for Isolators and Circulators
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Isolators and Circulators
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
236 results found for Isolators and Circulators/RF Passive Components
Part reference
Quality level / QPL
Package
Unit price
Lead time
ESCC B EQ
Not qualified
NOT LISTED IN QPL
ESCC B EQ
Not qualified
NOT LISTED IN QPL
ESCC B EQ
Not qualified
NOT LISTED IN QPL
ESCC B EQ
Not qualified
NOT LISTED IN QPL
ESCC
Not qualified
ESCC QPL
ESCC B EQ
Not qualified
NOT LISTED IN QPL
ESCC B EQ
Not qualified
NOT LISTED IN QPL
ESCC B EQ
Not qualified
NOT LISTED IN QPL
ESCC B EQ
Not qualified
NOT LISTED IN QPL
ESCC B EQ
Not qualified
NOT LISTED IN QPL
Part validation activities
Cost & Activity Matrix