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Bond Pull Test for High Voltage Rectifier
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for High Voltage Rectifier
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1631 results found for High Voltage/Rectifier/Diode/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Average Output Rectified Current [Max]
Forward Surge Current [Max]
Forward Voltage [Max]
Time for Reverse Recovery [Max]
Working Peak Reverse Voltage [Max]
Unit price
Lead time
JAN
Not qualified
QPDSIS-19500
Surface Mount
See Spec
13V
JANTX
Not qualified
QPDSIS-19500
Surface Mount
See Spec
3,5V
JANTX
Qualified
QPDSIS-19500
Surface Mount
Melf
500mA
25A
13V
70ns
10000V
JANTXV
Not qualified
QPDSIS-19500
Surface Mount
See Spec
3,5V
JANTX
Not qualified
QPDSIS-19500
Surface Mount
See Spec
8V
JAN
Not qualified
QPDSIS-19500
Surface Mount
See Spec
13V
JANTXV EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
HV Stick
2A
150A
11V
5us
10000V
JANS EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Melf
1A
40A
10,5V
90ns
5000V
JANTX EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
HV Stick
500mA
25A
38V
30ns
15000V
JANS EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
HV Stick