Servicio Familia 
Bond Pull Test for EMI-RFI Feedthu Filters
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for EMI-RFI Feedthu Filters
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
2417 results found for EMI-RFI Feedthrough/Filters
Part reference
Quality level / QPL
Package
Filter Type
Unit price
Lead time
ESCC B
Not qualified
ESCC QPL
Surface Mount
Melf
C-TYPE
ESCC C
Not qualified
ESCC QPL
Point to Point Wiring
See Spec
C-Type
ESCC C
Not qualified
ESCC QPL
Point to Point Wiring
See Spec
C-Type
ESCC B
Not qualified
ESCC QPL
Point to Point Wiring
See Spec
C-Type
ESCC B
Not qualified
ESCC QPL
Point to Point Wiring
See Spec
L-Type
ESCC C
Not qualified
ESCC QPL
Point to Point Wiring
See Spec
C-Type
ESCC C
Not qualified
ESCC QPL
Point to Point Wiring
See Spec
C-Type
ESCC B
Not qualified
ESCC QPL
Point to Point Wiring
See Spec
C-Type
ESCC C
Not qualified
ESCC QPL
Point to Point Wiring
See Spec
C-Type
ESCC B
Not qualified
ESCC QPL
Point to Point Wiring
See Spec
Pi-Type
Part validation activities
Cost & Activity Matrix